MEMS Packaging Technologies and 3D Integration (Hardback or Cased Book)
Seok, Seonho
ISBN 10: 3036542582 ISBN 13: 9783036542584
Published by Mdpi AG 6/1/2022, 2022
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About this Item
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MEMS Packaging Technologies and 3D Integration. Seller Inventory # BBS-9783036542584
Synopsis:
This Special Issue introduces recent research results on MEMS packaging and 3D integration whose subjects can be divided as follow; three papers on biocompatible implantable packaging, three papers on interconnect, three papers on bonding technologies, one paper on vacuum packaging, and three papers on modeling and simulation.
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Bibliographic Details
Title: MEMS Packaging Technologies and 3D ...
Publisher: Mdpi AG 6/1/2022
Publication Date: 2022
Binding: Hardback or Cased Book
Condition: New
Book Type: Book