Advanced Wirebond Interconnection Technology

Shankara K Prasad

ISBN 10: 1402077629 / ISBN 13: 9781402077623

Published by Springer Us Apr 2004, 2004

About this Item

Neuware - Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Seller Inventory # 9781402077623

Bibliographic Details

• Title: Advanced Wirebond Interconnection Technology
• Publisher: Springer Us Apr 2004
• Publication Date: 2004
• Language: English
• ISBN 10: 1402077629
• ISBN 13: 9781402077623
• Binding: Taschenbuch
• Condition: Neu

About this title

Synopsis

Advanced Wire Bond Interconnection Technology addresses wire bonding from both manufacturing and reliability perspectives. It analyzes and explores the various factors that one needs to consider: design, materials, processing, equipment, quality testing and reliability engineering, and last but not the least, operator training. This book is intended to be a comprehensive source of information and knowledge that enables both a newcomer to the field and a veteran who needs instant information to make a decision on a process problem. The book explains not only how to do things such as: designing a bond pad or a lead finger, how to select a right bond wire, how to design a capillary and how to optimize a bonding process on the factory floor; but the book also explains why to do it that way.

Review

From the reviews:

"....intended for an assembly production house setting, appropriate for management, designers, chief operators, as well as wirebond production engineers.... This book has excellent overall tutorial and enough description of wire and bonding equipment.... If you have not read a wirebonding book, or the one you read 10 years ago was borrowed and never returned, now is the time to buy this book." (IEEE CPMT, Newsletter)

"This book is intended for an assembly ... . is very good with ‘visual’ explanations for quick grasping of the issues. ... The book has a clear prose style and a very readable font and page layout. ... has excellent overall tutorial and enough description of wire and bonding equipment so the reader could specify and negotiate correctly for with suppliers. ... A short but good reference section is at the end." (David W. Palmer, IEEE / CPUT Newsletter, Vol. 28 (2), 2005)