This specific ISBN edition is currently not available.View all copies of this ISBN edition:
Manufacturers, managers, engineers and others who work with printed-circuit boards will find a wealth of information about surface-mount technology (SMT) and fine-pitch technology (FPT) in this book. Practical data and clear illustrations plainly present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for today's miniaturized electronics packaging.
"synopsis" may belong to another edition of this title.
Most thorough and informative SMT book on the market today
The race to adopt surface-mount technology, or SMT, has been described
as the latest revolution in electronics, and as established author
James K. Hollomon, Jr., points out, it holds great promise for the
manufacturing technology industry. Hollomon's latest book, Surface-
Mount Technology for PC Boards, will give everyone from the working
engineer to the interested layman the inside track on this pace-setting
Since its introduction, the largest roadblock for the complete acceptance
and efficiency of SMT has been a lack of communication. The "how-to"
knowledge of SMT must come from the factory floor, but the exchange of
ideas and demands between the electronics designers and manufacturing
personnel has been either nonexistent, or, at best, ineffective.
Surface-Mount Technology for PC Boards is perhaps the best means to date
to bridge this gap and provide a two-way street for communication between
the manufacturing technology and the printed wiring board layout considerations
Chapter 1: The Benefits and Limitations of Surface-Mount Technology (SMT)
Chapter information includes what SMT can do for circuitry, applications
where SMT may not make sense, common false perceptions regarding
adopting SMT, SMT manufacturing styles and their effect on benefits, and
actual examples of SMT benefits and limitations.
Chapter 2: Surface-Mount Components (SMCs)
Chapter information includes SMT passives, SMT actives, connectors and
sockets, switches, and other components.
Chapter 3: SMT Manufacturing Methods
Chapter information includes an overview of the SMT manufacturing
process, manufacturing styles of SMT, process steps and design, degree of
SMT automation, and manufacturing volume of SMT.
Chapter 4: System Design Considerations for SMT
Chapter information includes the simultaneous engineering approach,
system performance, form, fit and function, SMT manufacturing style,
manufacturability, manufacturing cost, capital investment evaluation,
system reliability, the manufacturing, storage and operating environment,
and design feedback.
Chapter 5: Printed-Wiring Layout Using SMCs
Chapter information includes component orientation, clearances around
components and test pads, traces and spaces, component lands, vias,
substrates and materials, handling thermal coefficient of expansion
mismatches, thermal management, solder masks, and high-frequency
Chapter 6: Assembly-Level Packaging and Interconnections
Chapter information includes SMT strategies to reduce system size,
board-level interconnects, board flexure, and environmental concerns and
Chapter 7: Quality Assurance in SMT
Chapter information includes component reliability and quality assurance,
printed-wiring board quality and reliability, quality and reliability of
materials and supplies, test and process control in manufacturing, testing
finished SMT assemblies, how to build testability into designs, and design
Chapter 8: Reviewing a New SMT Design - Is It Manufacturable?
Chapter information includes design constraints and manufacturing
resources, design for manufacturability, and nonmanufacturing issues in
Chapter 9: Hybrid Circuits and Multi-Chip Modules (MCMs)
Chapter information includes overview of hybrid technology, what SMT
offers in hybrid circuitry, actual examples of SMT hybrids, materials for
SMT hybrids, special SMT design rules for thick-film hybrids, special SMT
design rules for thin-film hybrids, SMT hybrid I/O interconnects and
packaging, SMT manufacturing methods for hybrids, and fundamentals of
Chapter 10: Using SMCs in Military and Space-Borne Applications
Chapter information includes the military's interest in SMT, SMT and the
VHSIC program, adapting SMT to military specifications, and NASA's
view of SMT.
Appendix A: Component and Land Geometries
Chapter information includes SMT component geometries,
ANSI/IPC-SM-782 land patterns, and land-pattern variations.
Appendix B: SMT Standards
Appendix C: SMT Bibliography
Appendix D: SMT Test Board Patterns
Appendix E: Glossary of SMT Terms
About the Author
James K. Hollomon, Jr., is the founder and president of AMTI, a firm
involved in training, consulting, and publishing information on SMT.
With over 10 years of engineering and management experience in SMT,
his previous appointments include both national president and chairman
of the Surface Mount Technology Association (SMTA) Standards Steering Committee
and activities chairman for the Santa Barbara chapter of the International
Society for Hybrid Microelectronics. Hollomon is currently heading the SMT
panel of the Electronic Equipment Supplier Committee of the China Lake Naval
Weapons Center, Electronic Manufacturing Productivity Facility.
In this text, practical data and illustrations present the details of design-for-manufacturability, environmental compliance, design-for-test, and quality/reliability for the modern miniaturized electronics packaging.
"About this title" may belong to another edition of this title.
Book Description Prompt (DPI - 8/01), 1995. Paperback. Condition: New. Never used!. Seller Inventory # P110790610604
Book Description Prompt (DPI - 8/01). PAPERBACK. Condition: New. 0790610604 New Condition. Seller Inventory # NEW99.2297471
Book Description Prompt (DPI - 8/01), 1995. Paperback. Condition: New. 1. Seller Inventory # DADAX0790610604