Lead-free Solders: Materials Reliability for Electronics (Wiley Series in Materials for Electronic & Optoelectronic Applications) - Hardcover

Hardcover

ISBN 10: 0470971827 ISBN 13: 9780470971826

Publisher: Wiley, 2012

Synopsis

Providing a viable alternative to lead-based solders is a major research thrust for the electrical and electronics industries - whilst mechanically compliant lead-based solders have been widely used in the electronic interconnects, the risks to human health and to the environment are too great to allow continued widescale usage. Lead-free Solders: Materials Reliability for Electronics chronicles the search for reliable drop-in lead-free alternatives and covers:

• Phase diagrams and alloy development
• Effect of minor alloying additions
• Composite approaches including nanoscale reinforcements
• Mechanical issues affecting reliability
• Reliability under impact loading
• Thermomechanical fatigue
• Chemical issues affecting reliability
• Whisker growth
• Electromigration
• Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

About this title

About the Author

K. N. Subramanian is Professor of Materials Science and Engineering at Michigan State University. He has been a full-time faculty member at MSU for over 45 years. For the last 15 years he has devoted all his research efforts to lead-free electronic solders.

• Phase diagrams and alloy development
• Effect of minor alloying additions
• Composite approaches including nanoscale reinforcements
• Mechanical issues affecting reliability
• Reliability under impact loading
• Thermomechanical fatigue
• Chemical issues affecting reliability
• Whisker growth
• Electromigration
• Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

• Phase diagrams and alloy development
• Effect of minor alloying additions
• Composite approaches including nanoscale reinforcements
• Mechanical issues affecting reliability
• Reliability under impact loading
• Thermomechanical fatigue
• Chemical issues affecting reliability
• Whisker growth
• Electromigration
• Thermomigration

Presenting a comprehensive understanding of the current state of lead-free electronic interconnects research, this book approaches the ongoing research from fundamental, applied and manufacturing perspectives to provide a balanced view of the progress made and the requirements which still have to be met.

Edition details

• Publisher: Wiley
• Publication date: 2012
• Language: English
• ISBN 10: 0470971827
• ISBN 13: 9780470971826
• Binding: Hardcover
• Edition number: 1
• Number of pages: 520
• Editor: Subramanian K.