Reliability and Failure of Electronic Materials and Devices, - Hardcover

Milton Ohring

Hardcover

ISBN 10: 0125249853 ISBN 13: 9780125249850

Publisher: Academic Press, 1998

Synopsis

Suitable as a reference work for reliability professionals or as a text for advanced undergraduate or graduate students, this book introduces the reader to the widely dispersed reliability literature of microelectronic and electronic-optional devices. "Reliability and Failure of Electronic Materials and Devices" integrates a treatment of chip and packaging level failures within the context of the atomic mechanisms and models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying thread of the book concerns product defects - their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices, acquire skills in the mathematical handling of reliability data, and better appreciate future technology trends and the reliability issues they raise. It discusses reliability and failure on both the chip and packaging levels and handles the role of defects in yield and reliability. It includes a tutorial chapter on the mathematics of reliability and focuses on electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of packages, contacts, and solder joints. It considers defect detection methods and failure analysis techniques.

About this title

From the Back Cover:

This book introduces the reader to the widely dispersed reliability literature of microelectronic and electro-optical devices. It integrates a treatment of chip models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying book thread concerns product defects-their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The book can be used as an advanced undergraduate/graduate textbook for materials scientists and electrical engineers, and as a reference for reliability professionals.

KEY FEATURES
* Discuss reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electomigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage, and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

ABOUT THE AUTHOR
Dr. Milton Ohring, author of two previously acclaimed Academic Press books, The Materials Science of Thin Films (1992), and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain deeper physical understanding of failure mechnanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.
|This book introduces the reader to the widely dispersed reliability literature of microelectronic and electro-optical devices. It integrates a treatment of chip models used to explain degradation, and the statistical handling of lifetime data. Electromigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage and the mechanical failure of contacts and solder joints are among the failure mechanisms considered. An underlying book thread concerns product defects-their relation to yield and reliability, the role they play in failure, and the way they are experimentally exposed. The book can be used as an advanced undergraduate/graduate textbook for materials scientists and electrical engineers, and as a reference for reliability professionals.

KEY FEATURES
* Discuss reliability and failure on both the chip and packaging levels
* Handles the role of defects in yield and reliability
* Includes a tutorial chapter on the mathematics of reliability
* Focuses on electomigration, dielectric breakdown, hot-electron effects, electrostatic discharge, corrosion, radiation damage, and the mechanical failure of packages, contacts, and solder joints
* Considers defect detection methods and failure analysis techniques

ABOUT THE AUTHOR
Dr. Milton Ohring, author of two previously acclaimed Academic Press books, The Materials Science of Thin Films (1992), and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain deeper physical understanding of failure mechnanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

About the Author:

Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise.

About this edition

• Publisher: Academic Press
• Publication date: 1998
• ISBN 10: 0125249853
• ISBN 13: 9780125249850
• Binding: Hardcover
• Number of pages: 250