When Ohring's Materials Science of Thin Films was first published in 1992, there were already at least 200 existing books on various aspects of thin film science and technology, but Ohring was quickly recognized as the first true textbook on the subject specifically intended for senior/graduate level classroom use in universities, as well as industrial in-house or short courses offered by professional societies. It offers the most comprehensive coverage of materials science and technology related to thin films and coatings of any book in the field. Partly because of that and because of the author's engaging writing style, Materials Science of Thin Films has been, and continues to be, the leading textbook in the field. The 3rd edition has been capably revised by Dr. Daniel Gall, associate professor of materials science and engineering at RPI, and Dr. Shefford Baker, associate professor of materials science and engineering at Cornell University. Content has been updated to include coverage of the latest and most important deposition techniques, including atomic layer deposition and high impulse magnetron sputtering. It includes new or expanded coverage of recent developments in thin films technology, such as filtered cathodic arcs, nanorod growth by the vapor-liquid-solid process, carbon nanotubes, new quantitative kinetic nucleation models, atomic-level growth classifications, bi-textured layers, surface morphological evolution models, and competitive grain growth.
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Dr. Milton Ohring, author of two previously acclaimed Academic Press books,The Materials Science of Thin Films (l992) and Engineering Materials Science (1995), has taught courses on reliability and failure in electronics at Bell Laboratories (AT&T and Lucent Technologies). From this perspective and the well-written tutorial style of the book, the reader will gain a deeper physical understanding of failure mechanisms in electronic materials and devices; acquire skills in the mathematical handling of reliability data; and better appreciate future technology trends and the reliability issues they raise. Professor Daniel Gall holds an associate professor position in the Materials Science and Engineering Department at the Rensselaer Polytechnic Institute. He received his Diploma from the University of Basel, Switzerland, in 1994, and his Ph.D. from the University of Illinois at Urbana-Champaign in 2000. Prof. Gall has been a Visiting Scientist at the Frederick Seitz Materials Research Laboratory, Illinois, has served as Assistant Editor and Editorial Board Member for Thin Solid Films, and as Associate Editor for the Journal of Vacuum Science and Technology A. He is the chair-elect of the AVS Advanced Surface Engineering Division and serves as session, symposium, and program chair and as proceedings editor for the International Conference for Metallurgical Coatings and Thin Films and the AVS International Symposium. Prof. Gall's research focuses on the development of an atomistic understanding for thin film growth, with particular interest in transition-metal nitride coatings, ion-surface interactions, and glancing angle deposition. He has pioneered a multiple length-scale approach to explain texture evolution in hard-coatings, has shown how low-energy ion-irradiation can be employed to control surface diffusion processes and resulting microstructures, and has developed a variety of uniquely shaped nanostructure architectures by exploiting atomic shadowing effects during physical vapor deposition. His research on novel transition-metal nitrides was identified as one of "the 100 most important scientific discoveries during the past two and a half decades, supported by the US Department of Energy's Office of Science". He also won the 2006 Alfred H. Geisler Memorial Award for "Outstanding Contributions in Education and Thin Film Growth Research," the Faculty Early Career Development (CAREER) Award from the National Science Foundation, the 2007 Outstanding Research Award from the Rensselaer School of Engineering, the 2008 Early Career Award for "Excellence in Educat
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