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Microchip Fabrication: A Practical Guide to Semiconductor Processing, Sixth Edition (ELECTRONICS) - Hardcover
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The most complete, current guide to semiconductor processing
Fully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.
State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.
COVERAGE INCLUDES:
- The semiconductor industry
- Properties of semiconductor materials and chemicals
- Crystal growth and silicon wafer preparation
- Wafer fabrication and packaging
- Contamination control
- Productivity and process yields
- Oxidation
- The ten-step patterning process--surface preparation to exposure; developing to final inspection
- Next generation lithography
- Doping
- Layer deposition
- Metallization
- Process and device evaluation
- The business of wafer fabrication
- Devices and integrated circuit formation
- Integrated circuits
- Packaging
"synopsis" may belong to another edition of this title.
About the Author:
Peter Van Zant is the Principal of Peter Van Zant Associates, a semiconductor manufacturing consulting and training company, and the author of all three previous editions of this widely read book. He has over 35 years in the semiconductor industry, working at IBM, Texas Instruments, and National Semiconductors. He resides in Grass Valley, California.
"About this title" may belong to another edition of this title.
- PublisherMcGraw Hill
- Publication date2013
- ISBN 10 0071821015
- ISBN 13 9780071821018
- BindingHardcover
- Edition number6
- Number of pages576
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Microchip Fabrication: A Practical Guide to Semiconductor Processing, 6th edition
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Book Description Trade paperback. Condition: New in new dust jacket. 6th Revised ed. INTERNATIONAL EDITION. ***INTERNATIONAL EDITION*** Read carefully before purchase: This book is the international edition in mint condition with the different ISBN and book cover design, the major content is printed in full English as same as the original North American edition. The book printed in black and white, generally send in twenty-four hours after the order confirmed. All shipments contain tracking numbers. Great professional textbook selling experience and expedite shipping service. Glued binding. Paper over boards. 548 p. Contains: Illustrations, black & white, Figures. Audience: General/trade. Seller Inventory # K0080000970
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Book Description Hardcover. Condition: new. Hardcover. Publisher's Note: Products purchased from Third Party sellers are not guaranteed by the publisher for quality, authenticity, or access to any online entitlements included with the product.The most complete, current guide to semiconductor processingFully revised to cover the latest advances in the field, Microchip Fabrication, Sixth Edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. This practical resource provides easy-to-understand information on the physics, chemistry, and electronic fundamentals underlying the sophisticated manufacturing materials and processes of modern semiconductors.State-of-the-art processes and cutting-edge technologies used in the patterning, doping, and layering steps are discussed in this new edition. Filled with detailed illustrations and real-world examples, this is a comprehensive, up-to-date introduction to the technological backbone of the high-tech industry.COVERAGE INCLUDES:The semiconductor industryProperties of semiconductor materials and chemicalsCrystal growth and silicon wafer preparationWafer fabrication and packagingContamination controlProductivity and process yieldsOxidationThe ten-step patterning process--surface preparation to exposure; developing to final inspectionNext generation lithographyDopingLayer depositionMetallizationProcess and device evaluationThe business of wafer fabricationDevices and integrated circuit formationIntegrated circuitsPackaging Fully revised to cover the latest advances in the field, this new edition explains every stage of semiconductor processing, from raw material preparation to testing to packaging and shipping the finished device. Detailed illustrations and real-world examples are included. Shipping may be from multiple locations in the US or from the UK, depending on stock availability. Seller Inventory # 9780071821018
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