Quantum-Well Laser Array Packaging: Nanoscale Pckaging Techniques (MECHANICAL ENGINEERING) - Hardcover

Tomm, Jens W.; Jim�nez, Juan

9780071460323: Quantum-Well Laser Array Packaging: Nanoscale Pckaging Techniques (MECHANICAL ENGINEERING)

Hardcover

ISBN 10: 0071460322 ISBN 13: 9780071460323

Publisher: McGraw Hill, 2006

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Quantum-well lasers offer the promise of lightning-fast data communications 10-to-100 times faster than broadband

While the architecture for these devices already exists, they suffer from material packaging problems. In this book the authors address this critical issue by providing researchers with state-of-the-art screening and packaging techniques not found in any other resource.

Key features

Degradation signatures occurring in high power laser bars exposed to high optical power densities

Failure prediction for different types of laser bars and technologies

Screening methodologies in high power laser bars with a classification of detected defects

In-depth degradation analysis of bars and single emitters

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From the Back Cover:

THE LATEST PACKAGING SOLUTIONS FOR QUANTUM-WELL LASERS

This groundbreaking reference presents state-of-the-art packaging techniques for high-power quantum-well laser arrays. These devices, with continuous-wave emission powers of several hundred watts, represent the most effective converters from electric energy into light ever created. Edited by two leading experts in the field, Quantum-Well Laser Array Packaging covers all critical issues related to material packaging problems and includes unique screening and packaging techniques not found in any other resource.

Get a complete overview of quantum-well laser diode array degradation
Examine innovative methods of strain measurement
Learn new imaging techniques for laser facet inspection
Explore promising directions in screening and failure prediction
Discover improved packaging techniques for reducing external stresses
Review current research on degradation modes and related defects in high-power laser bars

INSIDE Quantum-Well Laser Array Packaging

Overview of Laser Diode Degradation Mechanisms � Strain Measurement � Laser Facet Inspection by Imaging Techniques � Failure Prediction of High-Power Laser Bars � Reduction of External Stresses by Improved Packaging Techniques � Degradation Modes and Related Defects in High-Power Laser Bars

About the Author:

Jens W. Tomm (Berlin, Germany) is currently on the scientific staff of the Max-Born-Institut f�r Nichtlineare Optik und Kurzzeitspektroskopie where he serves as project leader. His work is focused on spectroscopic aging analysis of high-powered diode lasers, optical spectroscopy in such optoelectronic devices as high-powered semiconductor lasers, thermal analysis of optoelectronic devices by means of Raman-spectroscopy and Microthermography, device-related near-field scanning optical microscopy (NSOM) and Fourier-Transform (FT) spectroscopy, transient photoluminescence spectroscopy in III-V semiconductors/structures, and optoelectronic device development, and IR-LEDs for the 3-5 �m spectral range.

Juan Jim�nez (Valladolid, Spain) is a Full Professor at the University of Valladolid, R&D where as group leader, he researches optical characterization of semiconductors and devices using microscopic techniques. His research has been carried out in the frame of different academic and industrial projects around the world and funded by such institutions as the Spanish government, European Union, EOARD (European Office for Aerospace Research and Development), Alcatel Optronics, and Avanex among others.

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