MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Nanoscience and Technology)

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9780071455565: MEMS/MOEM Packaging: Concepts, Designs, Materials and Processes (Nanoscience and Technology)

While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging.

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From the Back Cover:

AUTHORITATIVE, COST-EFFECTIVE SOLUTIONS FOR MEMS AND MOEMS ASSEMBLIES

This is a rigorous examination of design concepts, fabrication processes, and properties of materials used in MEMS and MOEMS package construction and assembly, detailing routing, electrical performance, thermal management, hermeticity level, and reliability. The author also describes advanced packaging methods, including:

  • Wafer-level packaging
  • Microfluidic device packaging
  • Optical MEMS packaging
  • RF and microwave packaging
  • Laser sealing

Readers will find in-depth coverage of assembly technology and manufacturability, including cost issues.

CONTENT THAT SOLVES MEMS AND MOEMS PACKAGING & ASSEMBLY PROBLEMS:

  • Engineering fundamentals of packaging for MEMS and MOEMS devices
  • Principles, materials, and fabrication of MEMS and MOEMS devices
  • Evaluation methods for MEMS and MOEMS packaging challenges
  • MEMS packaging processes
  • From MEMS and MOEMS to nanotechnology

About the Author:

Ken Gilleo, Ph.D., is the CEO of ET-Trends, a consulting, packaging design, and IP firm specializing in emerging technologies. The firm’s projects include novel materials and packages and processes for MEMS, MOEMS, and optoelectronics. Dr. Gilleo is a member of IEEE and IMAPS, and he is also Vice President of Technical Programs for the Surface Mount Technology Association (SMTA). He has been actively involved in the development of new products for 30 years and is an inventor in circuitry, electronics materials, and packaging. Dr. Gilleo has 30 U.S. patents, and his products have received three R&D 100 Awards. Dr. Gilleo resides in Warwick, Rhode Island.

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Book Description McGraw-Hill Education - Europe, United States, 2005. Hardback. Book Condition: New. 230 x 152 mm. Language: English . Brand New Book ***** Print on Demand *****.While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. Bookseller Inventory # APC9780071455565

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Book Description McGraw-Hill Education - Europe, United States, 2005. Hardback. Book Condition: New. 230 x 152 mm. Language: English . Brand New Book ***** Print on Demand *****. While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. Bookseller Inventory # APC9780071455565

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Book Description McGraw-Hill Professional. Hardcover. Book Condition: New. Hardcover. 220 pages. Dimensions: 9.1in. x 6.0in. x 0.9in.While MEMS technology has progressed rapidly, commercialization of MEMS has been hindered by packaging technology barriers and costs. One of the key issues in the industrialization of MEMS, MOEM and ultimately Nanoelectrical devices is the development of appropriate packaging solutions for the protection, assembly, and long term reliable operation. This book rigorously examines the properties of the materials used in MEMS and MOEN assembly then evaluates them in terms of their routing, electrical performance, thermal management and reliability. With this as a starting point, the book moves on to discuss advanced packaging methods such as: molded thermoplastic packages for MEMS, wafer-assembled RFID, and wafer-level stacked packaging. This item ships from multiple locations. Your book may arrive from Roseburg,OR, La Vergne,TN. Hardcover. Bookseller Inventory # 9780071455565

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