Electronic Packaging and Interconnection Handbook 4/E

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9780071430487: Electronic Packaging and Interconnection Handbook 4/E

Provides a comprehensive reference in electronic packaging. This title offers a source of key reference data, practical guidance, and circuit and package design basics. It is intended for mechanical and electrical engineers, chemists, physicists, and materials scientists in various areas of the electronic packaging industry.

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From the Back Cover:

THE MOST COMPREHENSIVE REFERENCE IN ELECTRONIC PACKAGING―COMPLETELY UPDATED

From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry. This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies.

Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others.

Whether your area of expertise is design and manufacturing, quality control, or marketing, it's easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.

Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including:

  • Materials
  • Thermal Management
  • Shock, Vibration, and Operational Stress Management
  • Connector and Interconnection Technologies
  • Soldering and Cleaning Technologies
  • Single Chip Packaging and Ball Grid Arrays
  • Surface Mount Technology
  • Hybrid and Multichip Modules
  • Chip-Scale, Flip-Chip, and Direct-Chip Attachment
  • Rigid and Flexible Printed-Wiring Boards
  • Packaging High-Speed and Microwave Systems
  • Packaging High-Voltage Systems
  • Packaging of MEMs Systems
  • Packaging of Optoelectronic Systems

About the Author:

Charles A. Harper is president of Technology Seminars, Inc., Lutherville, Maryland, an organization dedicated to the presentation of educational seminars on electronic packaging and materials. He has authored over a dozen well-known books in the field and is among the founders and past presidents of the International Microelectronics and Packaging Society. He is also series editor for the McGraw-Hill Electronic Packaging and Interconnection Series. Mr. Harper is a graduate of the Johns Hopkins University School of Engineering, where he also served as adjunct professor.

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Book Description McGraw-Hill Education - Europe, United States, 2004. Hardback. Book Condition: New. 4th edition. Language: English . Brand New Book ***** Print on Demand *****.This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it s easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials; Thermal Management Shock, Vibration, and Operational Stress Management; Connector and Interconnection Technologies; Soldering and Cleaning Technologies; Single Chip Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Modules; Chip-Scale, Flip-Chip, and Direct-Chip Attachment; Rigid and Flexible Printed-Wiring Boards; Packaging High-Speed and Microwave Systems; Packaging High-Voltage Systems; Packaging of MEMs Systems; and, Packaging of Optoelectronic Systems. Bookseller Inventory # APC9780071430487

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Book Description McGraw-Hill Education - Europe, United States, 2004. Hardback. Book Condition: New. 4th edition. Language: English . Brand New Book ***** Print on Demand *****. This is the most comprehensive reference in electronic packaging - completely updated. From new materials and technologies to increasingly prevalent lead-free manufacturing practices, Electronic Packaging and Interconnection Handbook offers a unique source of key reference data, practical guidance, and circuit and package design basics. Through three best-selling editions, this classic reference has served those involved in the design, manufacture, testing, and use of all types of electronic packaging, becoming the most widely used reference in the industry.This thoroughly revised and expanded Fourth Edition adds new information on key MEMs; optoelectronic, single-chip, and high-speed technologies; and updates important chapters on ball grid array and flip chip technologies. Of interest to mechanical and electrical engineers, chemists, physicists, and materials scientists in all areas of the electronic packaging industry, the book takes a unique interdisciplinary approach to the field, allowing specialists in one area to understand the needs and responsibilities of others. Whether your area of expertise is design and manufacturing, quality control, or marketing, it s easy to see why the Fourth Edition of the Electronic Packaging and Interconnection Handbook makes an excellent addition to your reference arsenal.Written by a team of experts from around the globe, this remarkable volume covers all aspects of electronic packaging, including: Materials; Thermal Management Shock, Vibration, and Operational Stress Management; Connector and Interconnection Technologies; Soldering and Cleaning Technologies; Single Chip Packaging and Ball Grid Arrays; Surface Mount Technology; Hybrid and Multichip Modules; Chip-Scale, Flip-Chip, and Direct-Chip Attachment; Rigid and Flexible Printed-Wiring Boards; Packaging High-Speed and Microwave Systems; Packaging High-Voltage Systems; Packaging of MEMs Systems; and, Packaging of Optoelectronic Systems. Bookseller Inventory # APC9780071430487

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