Thermal Management Handbook: For Electronic Assemblies (Electronic Packaging and Interconnection)

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9780070266995: Thermal Management Handbook: For Electronic Assemblies (Electronic Packaging and Interconnection)

HardCover. Pub Date: 1998 Pages: 650 Publisher: McGraw-Hill Professional In recent years. heat-sensitive electronic systems have been Miniaturized far more than their heat-producing Power Supplies Leading to major Design and Reliability Challenges - and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards. hyid circuits. and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions. thus enabling more intelligent decisions at the design stage - and preventing thermal-related problems from occurring in the first place.

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In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges — and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage — and preventing thermal-related problems from occurring in the first place.

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The "hands-on" guide to thermal management! Thermal Management Handbook.In recent years, heat-sensitive electronics systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook is the most current and comprehensive reference on the practical issues that any packaging engineer must consider with regard to the thermal management f printed circuit boards, hybrid circuits, and multichip modules. In addition to presenting and exploring the three basic issues at the core of effective thermal management - how and where the heat is generated; how the temperature at a given point in the circuit is determined; and how the heat is removed - the book is enhanced with tutorial chapters, data tables, and a wealth of design examples. Professionals will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design state - and preventing thermal-related problems from occurring in the first place.

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Book Description McGraw-Hill Education - Europe, United States, 1998. Undefined. Book Condition: New. New.. 231 x 155 mm. Language: English . Brand New Book ***** Print on Demand *****.In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage - and preventing thermal-related problems from occurring in the first place. Bookseller Inventory # APC9780070266995

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Book Description McGraw-Hill Education - Europe, United States, 1998. Undefined. Book Condition: New. New.. 231 x 155 mm. Language: English . Brand New Book ***** Print on Demand *****. In recent years, heat-sensitive electronic systems have been miniaturized far more than their heat-producing power supplies, leading to major design and reliability challenges - and making thermal management a critical design factor. This timely handbook covers all the practical issues that any packaging engineer must consider with regard to the thermal management of printed circuit boards, hybrid circuits, and multichip modules. Readers will also benefit from the extensive data on material properties and circuit functions, thus enabling more intelligent decisions at the design stage - and preventing thermal-related problems from occurring in the first place. Bookseller Inventory # APC9780070266995

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