Items related to Electronic Packaging and Interconnection Handbook
This handbook is a complete, comprehensive reference to all aspects of electronic packaging, from fundamentals (Part 1) to systems (Part III). Increasingly, it is the package - not the integrated circuit - that is the limiting factor in modern, high-density, high performance electronic systems. This handbook provides in-depth coverage of this interdisciplinary field, combinating electrical, electronics, mechanical and materials principles and techniques.
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The field's only comprehensive reference MEMs packaging Optoelectronic packaging Ball grid array, flip chip, and direct chip attach
Intended for electronic engineers, this handbook describes the various approaches to handling thermal management issues in electronic packaging, the function and structure of connectors, and the properties of solder technologies for electronic assembly. Other topics of the ten chapters include integrated circuit packaging, ball grid arrays, hybrid microelectronics, multichip modules, chip scale packaging, flip chip attachment, and printed wiring boards. Originally published as "Handbook of Electronic Packaging," the fourth edition adds material on microelectromechanical (MEM) systems and high speed technologies..
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- PublisherMcGraw-Hill Inc.,US
- Publication date1991
- ISBN 10 0070266840
- ISBN 13 9780070266841
- BindingHardcover
- Number of pages1120
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Electronic Packaging and Interconnection Handbook
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ISBN 13: 9780070266841
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Electronic Packaging and Interconnection Handbook
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Electronic Packaging and Interconnection Handbook
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Electronic Packaging And Interconnection Handbook
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Electronic Packaging and Interconnection Handbook
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ISBN 13: 9780070266841
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Electronic Packaging and Interconnection Handbook
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(1991)
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